Title:
COMPOSITION AND CURED BODY
Document Type and Number:
WIPO Patent Application WO/2022/014599
Kind Code:
A1
Abstract:
Provided are a varnish having a low viscosity and, obtained therefrom, a cured body that exhibits a high degree of crosslinking and is excellent in terms of low dielectric properties, high temperature mechanical properties and low coefficient of linear expansion. According to the present invention, a varnish contains: an olefin-aromatic vinyl compound-aromatic polyene copolymer oligomer that satisfies specific conditions; one or more components selected from among (a) to (c); and (d) a solvent. (a) is a curing agent; (b) is one or more resins selected from among a hydrocarbon-based elastomer, a poly(phenylene ether)-based resin, an olefin-aromatic vinyl compound-aromatic polyene copolymer and an aromatic polyene-based resin; (c) is a polar monomer. A cured body is obtained from the varnish.
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Inventors:
ARAI TORU (JP)
Application Number:
PCT/JP2021/026324
Publication Date:
January 20, 2022
Filing Date:
July 13, 2021
Export Citation:
Assignee:
DENKA COMPANY LTD (JP)
International Classes:
C08F4/6592; C09D5/00; C08F210/00; C08F212/08; C08F212/36; C08K5/14; C08L21/00; C08L23/02; C08L25/04; C09D123/00; C09D125/02; C09D201/00; H01B3/44
Domestic Patent References:
WO1994010216A1 | 1994-05-11 | |||
WO2021112088A1 | 2021-06-10 | |||
WO2016114287A1 | 2016-07-21 | |||
WO2000037517A1 | 2000-06-29 |
Foreign References:
JP2010280771A | 2010-12-16 | |||
JP2003026730A | 2003-01-29 | |||
JP2010280860A | 2010-12-16 | |||
JPH0940709A | 1997-02-10 | |||
JPS5231272A | 1977-03-09 | |||
JPH06192392A | 1994-07-12 | |||
JPH1160645A | 1999-03-02 | |||
JP2004087639A | 2004-03-18 | |||
JP2010280771A | 2010-12-16 | |||
JP2009161743A | 2009-07-23 | |||
JP2010280860A | 2010-12-16 | |||
JPH0940709A | 1997-02-10 | |||
JP2008291227A | 2008-12-04 | |||
EP0872492A2 | 1998-10-21 | |||
JPH11130808A | 1999-05-18 | |||
JPH09309925A | 1997-12-02 | |||
JPS6320426B2 | 1988-04-27 | |||
EP0985689A1 | 2000-03-15 | |||
JPH06184179A | 1994-07-05 | |||
JP2010280771A | 2010-12-16 |
Other References:
M. KAWABE ET AL., JOURNAL OF THE JAPAN INSTITUTE OF ELECTRONICS PACKAGING, vol. 12, no. 2, 2009, pages 125
See also references of EP 4183843A4
See also references of EP 4183843A4
Attorney, Agent or Firm:
AXIS PATENT INTERNATIONAL (JP)
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