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Title:
COMPOSITION FOR DIP MOLDING, METHOD FOR PRODUCING GLOVE, AND GLOVE
Document Type and Number:
WIPO Patent Application WO/2021/010334
Kind Code:
A1
Abstract:
The present invention provides a composition for dip molding, said composition containing at least: an elastomer which contains, in the polymer main chain, a structural unit derived from (meth)acrylonitrile, a structural unit derived from an unsaturated carboxylic acid, and a structural unit derived from butadiene; a polycarbodiimide; an epoxy crosslinking agent; water; and a pH adjuster. With respect to this composition for dip molding, the elastomer contains from 12% by weight to 36% by weight of the structural unit derived from (meth)acrylonitrile, from 2% by weight to 10% by weight of the structural unit derived from an unsaturated carboxylic acid, and from 50% by weight to 75% by weight of the structural unit derived from butadiene; the epoxy crosslinking agent includes an epoxy crosslinking agent containing an epoxy compound that has three or more epoxy groups in each molecule; and the polycarbodiimide includes at least one polycarbodiimide that contains a hydrophilic segment in the molecular structure.

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Inventors:
ENOMOTO NORIHIDE (JP)
MORINAGA ATSUSHI (JP)
Application Number:
PCT/JP2020/027068
Publication Date:
January 21, 2021
Filing Date:
July 10, 2020
Export Citation:
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Assignee:
MIDORI ANZEN CO LTD (JP)
International Classes:
B29C41/14; A41D19/00; A41D19/04; C08K5/29; C08L13/00; C08L63/00
Domestic Patent References:
WO2017217542A12017-12-21
WO2018188966A12018-10-18
WO2019102985A12019-05-31
WO2017126660A12017-07-27
WO2019194056A12019-10-10
Foreign References:
JP2017213914A2017-12-07
JP2010144163A2010-07-01
JP2020037635A2020-03-12
Attorney, Agent or Firm:
IP FIRM SHUWA (JP)
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