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Title:
COMPOSITION FOR DIP MOLDING AND MOLDED BODY THEREOF
Document Type and Number:
WIPO Patent Application WO/2022/065491
Kind Code:
A1
Abstract:
This composition for dip molding contains at least a nitrile rubber elastomer containing a carboxylic group and an amido group, wherein: the elastomer contains 50-78 wt% of a structural unit derived from a conjugate diene monomer, 17-35 wt% of a structural unit derived from an ethylenic unsaturated nitrile monomer, 2.0-8.0 wt% of a structural unit derived from an ethylenic unsaturated carboxylic acid monomer, and 0.5-5.0 wt% of a structural unit derived from an amide group-containing monomer; and the undissolved MEK amount of the elastomer is 50-80 wt%.

Inventors:
ENOMOTO NORIHIDE (JP)
MORINAGA ATSUSHI (JP)
TAKEUCHI YAMATO (JP)
OTA HISANORI (TH)
Application Number:
PCT/JP2021/035405
Publication Date:
March 31, 2022
Filing Date:
September 27, 2021
Export Citation:
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Assignee:
MIDORI ANZEN CO LTD (JP)
BST SPECIALTY CO LTD (TH)
International Classes:
C08L13/02; B29C41/14; B29C41/36; C08G59/42; C08K3/22; C08L63/00
Domestic Patent References:
WO2014034889A12014-03-06
WO2019194056A12019-10-10
WO2019102985A12019-05-31
WO2015129871A12015-09-03
WO2012043894A12012-04-05
WO2012043894A12012-04-05
WO2017217542A12017-12-21
WO2019194056A12019-10-10
Foreign References:
JP2017149928A2017-08-31
JP2020505492A2020-02-20
JP2017160279A2017-09-14
JPH11293043A1999-10-26
JP2008512526A2008-04-24
US20110229646A12011-09-22
US20120149859A12012-06-14
JP2018009272A2018-01-18
Attorney, Agent or Firm:
IP FIRM SHUWA (JP)
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