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Patent Searching and Data


Title:
COMPOSITION FOR FORMING FLEXIBLE DEVICE SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2018/097142
Kind Code:
A1
Abstract:
[Problem] To provide a composition for forming a flexible device substrate that has excellent heat resistance, low retardation, excellent flexibility, and excellent transparency and that thereby maintains excellent performance while yielding a resin thin film having excellent performance as a base film for a flexible device substrate, for example, a flexible display substrate which can be easily peeled from a glass carrier by an LLO method. [Solution] A composition for forming a flexible device substrate comprising: a polyimide that is a reaction product of a tetracarboxylic acid dianyhdride component containing an alicyclic tetracarboxylic dianhydride and an aromatic tetracarboxylic dianhydride represented by formula (D1) and a diamine component containing a fluorine-containing aromatic diamine; and an organic solvent (in the formula, E represents a single bond, a carbonyl group, an oxygen atom, a sulfur atom, SO, or SO2).

Inventors:
YE CHENJIA (TW)
KITA HIROSHI (TW)
Application Number:
PCT/JP2017/041876
Publication Date:
May 31, 2018
Filing Date:
November 21, 2017
Export Citation:
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Assignee:
NISSAN CHEMICAL IND LTD (JP)
International Classes:
C08L79/08; C08G73/10; C08K3/36; C08K5/00; G02F1/1337; H05K1/03
Domestic Patent References:
WO2015122032A12015-08-20
WO2015002273A12015-01-08
WO2016158990A12016-10-06
Foreign References:
JP2015004062A2015-01-08
Attorney, Agent or Firm:
HANABUSA PATENT & TRADEMARK OFFICE (JP)
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