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Patent Searching and Data


Title:
COMPOSITION FOR FORMING PRESSURE-SENSITIVE ADHESIVE, PRODUCTION METHOD THEREFOR, AND PRESSURE-SENSITIVE ADHESIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/021975
Kind Code:
A1
Abstract:
A composition for forming pressure-sensitive adhesives which comprises a monofunctional (meth)acryl monomer having a poly(lactic acid) structure, a polyfunctional (meth)acryl monomer having a poly(lactic acid) structure, and a non-functional compound having a poly(lactic acid) structure, wherein the content of the non-functional compound having a poly(lactic acid) structure is 10 mol% or higher.

Inventors:
HATSUDA KOUKI (JP)
NAGASHIMA MINORU (JP)
YANG HE (JP)
WAKU KAORI (JP)
NOGUCHI TAKESHI (JP)
Application Number:
PCT/JP2022/029564
Publication Date:
February 23, 2023
Filing Date:
August 01, 2022
Export Citation:
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Assignee:
DEXERIALS CORP (JP)
International Classes:
C09J133/04; C09J7/38; C09J167/04
Foreign References:
CN110564355A2019-12-13
JP2014532488A2014-12-08
JP2011088960A2011-05-06
JP2008050514A2008-03-06
CN104004173A2014-08-27
CN112538321A2021-03-23
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
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