Title:
COMPOSITION FOR FORMING RESIST UNDERLAYER FILM
Document Type and Number:
WIPO Patent Application WO/2020/184642
Kind Code:
A1
Abstract:
Provided is a composition for forming a resist underlayer film that is insoluble in resist solvents, has favorable optical constants, and has a high etching rate. The composition has excellent ability to fill and flatten stepped substrates. A composition for forming a resist underlayer film, the composition including: (A) a cross-linking compound that is represented by formula (I); and (D) a solvent. [In formula (I), m is an integer from 1 to 30, T is a single bond, a saturated hydrocarbon group, an aromatic group, or an unsaturated cyclic hydrocarbon group, G1, G2, G3, G4, G5, and G6 are each independently (i) or (ii), the n's are each independently an integer from 1 to 8, the n R's are each independently a hydrogen atom, an aliphatic hydrocarbon group, or an alicyclic hydrocarbon group, the A's are each independently an aryl group that may be interrupted by an alkylene group, and Z1, Z2, Z3, Z4, Z5, and Z6 are each independently an alkyl group, an aryl group, a hydroxy group, an epoxy group, or a hydrogen atom.]
Inventors:
TOKUNAGA HIKARU (JP)
OGATA HIROTO (JP)
HIROHARA TOMOTADA (JP)
NAKAJIMA MAKOTO (JP)
OGATA HIROTO (JP)
HIROHARA TOMOTADA (JP)
NAKAJIMA MAKOTO (JP)
Application Number:
PCT/JP2020/010686
Publication Date:
September 17, 2020
Filing Date:
March 12, 2020
Export Citation:
Assignee:
NISSAN CHEMICAL CORP (JP)
International Classes:
C07C43/23; C07C69/767; C08G8/20; C08G59/04; C08L101/00; G03F7/11; G03F7/20; G03F7/26; H01L21/027
Domestic Patent References:
| WO2014038680A1 | 2014-03-13 |
Foreign References:
| JP2006259249A | 2006-09-28 | |||
| JP2007316282A | 2007-12-06 |
Attorney, Agent or Firm:
TSUKUNI & ASSOCIATES et al. (JP)
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