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Patent Searching and Data


Title:
COMPOSITION FOR FORMING THERMALLY CONDUCTIVE MATERIAL, AND THERMALLY CONDUCTIVE MATERIAL
Document Type and Number:
WIPO Patent Application WO/2020/158259
Kind Code:
A1
Abstract:
The present invention provides a composition for forming a thermally conductive material, which enables the achievement of a thermally conductive material that has excellent thermal conductivity. The present invention also provides a thermally conductive material. This composition for forming a thermally conductive material contains a compound represented by general formula (1), a phenolic compound and an inorganic material; and the content of the compound represented by general formula (1) is 30.0% by mass or more relative to the total organic solid content. (1): (X-Z1-)m-A-(-Z2-Y)n

Inventors:
HAYASHI DAISUKE (JP)
HITOMI SEIICHI (JP)
NIORI TERUKI (JP)
TAKAHASHI KEITA (JP)
Application Number:
PCT/JP2019/050619
Publication Date:
August 06, 2020
Filing Date:
December 24, 2019
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
C08G59/32; C08G59/62; C08K3/38; C08K9/04; C08L63/00; C09K5/14
Domestic Patent References:
WO2016104136A12016-06-30
WO2016010067A12016-01-21
Foreign References:
JP2015535308A2015-12-10
JP2014094937A2014-05-22
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JP2014177581A2014-09-25
JP2005531667A2005-10-20
JP2008545869A2008-12-18
JPH07306317A1995-11-21
JPH07306317A1995-11-21
JP2007002220A2007-01-11
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JP4694929B22011-06-08
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Other References:
ANGEW. CHEM. INT. ED., vol. 51, 2012, pages 7990 - 7993
C. DESTRADE ET AL.: "Mol. Crysr. Liq. Cryst.", vol. 71, 1981, THE CHEMICAL SOCIETY OF JAPAN, article "Chemistry of liquid crystal", pages: 111
B. KOHNE ET AL., ANGEW. CHEM. SOC. CHEM. COMM., 1985, pages 1794
J. ZHANG ET AL., J. AM. CHEM. SOC., vol. 116, 1994, pages 2655
YOSHITAKA TAKEZAWA: "Highly Thermally Conductive Composite Material", CMC PUBLISHING CO., LTD.
See also references of EP 3919540A4
Attorney, Agent or Firm:
NAKASHIMA Junko et al. (JP)
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