Title:
COMPOSITION FOR LOW DIELECTRIC HEAT CONDUCTIVE MATERIAL AND LOW DIELECTRIC HEAT CONDUCTIVE MATERIAL
Document Type and Number:
WIPO Patent Application WO/2020/095763
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a novel low dielectric heat conductive material, etc. that do not use a hollow filler. This composition for a low dielectric heat conductive material comprises: an acrylic resin composition that includes one or more (meth)acrylates and an acrylic polymer formed by polymerizing one or more (meth)acrylates; crystalline silica that has an average particle size of 20 μm or more; a metalhydroxide that has an average particle size of 15 μm or less; a polyfunctional monomer; and a polymerization initiator. The crystalline silica, metalhydroxide, polyfunctional monomer, and polymerization initiator are blended, respectively, in amounts of 330 to 440 parts by mass, 90 to 190 parts by mass, 0.01 to 0.5 parts by mass, and 0.6 to 1.3 parts by mass relative to 100 parts by mass of the acrylic resin composition.
Inventors:
LI JIANGUANG (JP)
SAITO MASAHIRO (JP)
YUOKA TERUAKI (JP)
SAITO MASAHIRO (JP)
YUOKA TERUAKI (JP)
Application Number:
PCT/JP2019/042383
Publication Date:
May 14, 2020
Filing Date:
October 29, 2019
Export Citation:
Assignee:
KITAGAWA IND CO LTD (JP)
International Classes:
H01L23/373; C08K3/22; C08L33/04; H01L33/48; H05K7/20
Foreign References:
| JP2017199776A | 2017-11-02 | |||
| JP2000186214A | 2000-07-04 | |||
| JP2018012784A | 2018-01-25 | |||
| JP2012119674A | 2012-06-21 |
Attorney, Agent or Firm:
AKATSUKI UNION PATENT FIRM (JP)
Download PDF: