Title:
COMPOSITION FOR PATTERN FORMATION, KIT, CURED FILM, MULTILAYER BODY, PATTERN FORMING METHOD AND METHOD FOR PRODUCING SEMICONDUCTOR ELEMENT
Document Type and Number:
WIPO Patent Application WO/2020/203386
Kind Code:
A1
Abstract:
A composition for pattern formation, which contains a polymerizable compound, a photopolymerization initiator and a sensitizer that contains two or more atoms of at least one element selected from the group consisting of nitrogen atoms and sulfur atoms, wherein the length of a specific atomic chain from one atom to another atom among the two or more atoms is 2 or 3 in terms of the number of atoms; a kit which applies this composition for pattern formation; a cured film; a multilayer body; a pattern forming method; and a method for producing a semiconductor element.
Inventors:
GOTO YUICHIRO (JP)
SHIMOJU NAOYA (JP)
SHIBUYA AKINORI (JP)
HAKAMATA AKIHIRO (JP)
SHIMOJU NAOYA (JP)
SHIBUYA AKINORI (JP)
HAKAMATA AKIHIRO (JP)
Application Number:
PCT/JP2020/012595
Publication Date:
October 08, 2020
Filing Date:
March 23, 2020
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
C08F220/10; B29C59/02; C08F2/50; H01L21/027
Domestic Patent References:
| WO2018230488A1 | 2018-12-20 |
Foreign References:
| JP2011111553A | 2011-06-09 | |||
| JP2005128508A | 2005-05-19 | |||
| JP2007233184A | 2007-09-13 | |||
| JP2007079477A | 2007-03-29 |
Attorney, Agent or Firm:
SIKs & Co. (JP)
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