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Patent Searching and Data


Title:
COMPOSITION FOR REMOVING PHOTORESIST
Document Type and Number:
WIPO Patent Application WO/2021/020410
Kind Code:
A1
Abstract:
The present invention provides: an aqueous composition capable of removing a photoresist from a printed wiring board or a semiconductor wafer while preventing corrosion of tin plating and tin alloy plating in addition to a copper wiring; and a method for removing a photoresist using the aqueous composition. The aqueous composition according to the present invention is characterized by comprising an alkanolamine (A), a quaternary ammonium hydroxide (B), a sugar alcohol (C), a polar organic solvent (D), and water (E), wherein, with respect to the total amount of the composition, the content of the alkanolamine (A) is 2.5-50 mass%, the content of the quaternary ammonium hydroxide (B) is 0.5-4 mass%, and the content of the sugar alcohol (C) is 0.5-20 mass%.

Inventors:
NAITO YUKIHIDE (JP)
OHMAE KENSUKE (JP)
MATSUNAGA HIROSHI (JP)
TAMAI SATOSHI (JP)
Application Number:
PCT/JP2020/028957
Publication Date:
February 04, 2021
Filing Date:
July 29, 2020
Export Citation:
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Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
RYOKO CHEMICAL CO LTD (JP)
International Classes:
G03F7/20; G03F7/42; H01L21/027; H05K3/18
Foreign References:
JP2009115929A2009-05-28
JP2004038073A2004-02-05
US6440326B12002-08-27
JP2003122029A2003-04-25
JP2004134783A2004-04-30
JPH09319098A1997-12-12
Attorney, Agent or Firm:
KOBAYASHI Hiroshi et al. (JP)
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