Title:
COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2017/170955
Kind Code:
A1
Abstract:
Provided is a composition which exhibits sufficient adhesive strength even after a high-temperature treatment. The composition comprises (1) polymerizable monomers comprising an ingredient (1-1) which is a monofunctional polymerizable monomer having an aromatic ring and an ingredient (1-2) which is a polymerizable monomer other than the ingredient (1-1), (2) an elastomer, (3) a polymerization initiator, (4) a reducing agent, and (5) an inorganic anion exchanger.
Inventors:
SERIZAWA SHINYA (JP)
SASAKI MAKIKO (JP)
NAKAJIMA GOSUKE (JP)
SASAKI MAKIKO (JP)
NAKAJIMA GOSUKE (JP)
Application Number:
PCT/JP2017/013449
Publication Date:
October 05, 2017
Filing Date:
March 30, 2017
Export Citation:
Assignee:
DENKA COMPANY LTD (JP)
International Classes:
C08F2/44; C08F291/02; C09J4/00; C09J11/04; C09J201/00
Domestic Patent References:
WO2008108273A1 | 2008-09-12 |
Foreign References:
JP2015049517A | 2015-03-16 | |||
JP2001261724A | 2001-09-26 | |||
JP2014108983A | 2014-06-12 | |||
JP2001271037A | 2001-10-02 | |||
JP2007070616A | 2007-03-22 |
Attorney, Agent or Firm:
AXIS PATENT INTERNATIONAL (JP)
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