Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
COMPOUND, BONDING AGENT, JOINED BODY, PRINTED SUBSTRATE, AND METHOD FOR MANUFACTURING BONDED BODY
Document Type and Number:
WIPO Patent Application WO/2022/145352
Kind Code:
A1
Abstract:
The present disclosure is a compound that includes, in a molecule: at least one functional group of an OH group and an OH-generating group; an organic group that contains a carbon-carbon double bond; and a triazine ring.

Inventors:
HAPPOYA AKIHIKO (JP)
ISHIKAWA SHINSUKE (JP)
MORI KATSUHITO (JP)
Application Number:
PCT/JP2021/048015
Publication Date:
July 07, 2022
Filing Date:
December 23, 2021
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
DAICEL CORP (JP)
SULFUR CHEMICAL LABORATORY INC (JP)
International Classes:
C07F7/18; B32B15/08; B32B15/082; B32B15/20; B32B27/00; B32B27/30; C09D5/00; C09D7/63; H05K3/38
Domestic Patent References:
WO2020158604A12020-08-06
WO2005072949A12005-08-11
WO2012077676A12012-06-14
Foreign References:
JP2012509979A2012-04-26
GB1466992A1977-03-16
JP2005036050A2005-02-10
JP2007002233A2007-01-11
JPH1112330A1999-01-19
JPH1112544A1999-01-19
JPH1017828A1998-01-20
JPS63265982A1988-11-02
JP2008262802A2008-10-30
Attorney, Agent or Firm:
ARCO PATENT & TRADEMARK ATTORNEYS (JP)
Download PDF: