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Patent Searching and Data


Title:
COMPUTATION DEVICE, DETECTION SYSTEM, MOLDING DEVICE, COMPUTATION METHOD, DETECTION METHOD, MOLDING METHOD, COMPUTATION PROGRAM, DETECTION PROGRAM, AND MOLDING PROGRAM
Document Type and Number:
WIPO Patent Application WO/2019/239531
Kind Code:
A1
Abstract:
This computation device used in a molding device for molding a three-dimensional molded object from a solid layer molded by heating a layer-shaped material layer, formed from a powder material, by irradiation with energy rays is provided with a detection unit for determining a state of the material layer based on the shape of the formed material layer, and an output unit for outputting information relating to the state of the material layer determined by the detection unit, in order to set a molding condition for the molding device.

Inventors:
TAKESHITA KOKI (JP)
Application Number:
PCT/JP2018/022622
Publication Date:
December 19, 2019
Filing Date:
June 13, 2018
Export Citation:
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Assignee:
NIKON CORP (JP)
TECH RES ASSOCIATION FUTURE ADDITIVE MANUFACTURING (JP)
International Classes:
B29C64/386; B22F3/105; B22F3/16; B29C64/153; B33Y30/00; B33Y50/00; B33Y50/02
Domestic Patent References:
WO2016143137A12016-09-15
WO2017163432A12017-09-28
Foreign References:
JPH06503764A1994-04-28
JP2017094540A2017-06-01
US5460758A1995-10-24
JP2006059014A2006-03-02
Attorney, Agent or Firm:
NAGAI, Fuyuki et al. (JP)
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