Title:
CONDUCTIVE ADHESIVE, AND ADHESIVE STRUCTURE AND ELECTRONIC COMPONENT USING SAME
Document Type and Number:
WIPO Patent Application WO/2021/079852
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a conductive adhesive using an ultraviolet curing resin, said conductive adhesive having excellent adhesiveness and high storage stability, and an adhesive structure and an electronic component in which the conductive adhesive is used. A conductive adhesive comprising: a (meth)acrylate (A); a photopolymerization initiator (B); a phosphate group-containing monomer (C); a phosphate ion inactivator (D); and conductive particles (E). As the phosphate ion inactivator (D), a compound which adsorbs phosphate ions and thus inactivates the same and/or a compound which reacts with phosphate ions and thus inactivates the same can be preferably used.
Inventors:
TOKUTAKE MARI (JP)
ABE SHINJI (JP)
ABE SHINJI (JP)
Application Number:
PCT/JP2020/039297
Publication Date:
April 29, 2021
Filing Date:
October 19, 2020
Export Citation:
Assignee:
NIPPON CHEMICAL IND (JP)
International Classes:
C09J4/02; C09J9/02; C09J11/04; C09J11/06; H01B1/00; H01B1/22; H01B5/00; H01B5/16
Domestic Patent References:
| WO2019050006A1 | 2019-03-14 |
Foreign References:
| JP2003089775A | 2003-03-28 | |||
| JP2018159042A | 2018-10-11 | |||
| JP2013098230A | 2013-05-20 | |||
| US0499136A | 1893-06-06 |
Download PDF: