Title:
CONDUCTIVE MEMBER, TOUCH PANEL SENSOR, TOUCH PANEL, AND METHOD FOR MANUFACTURING MOLDED BODY
Document Type and Number:
WIPO Patent Application WO/2020/067232
Kind Code:
A1
Abstract:
[Problem] The first problem to be addressed by the present invention is to provide a conductive member which has excellent impact resistance and with which the disconnection of thin metal wires is inhibited when the conductive member is used in a process where there is exposure to a high-temperature and/or high-pressure environment. The second problem to be addressed by the present invention is to provide a touch panel sensor and a touch panel that use the conductive member. The third problem to be addressed by the present invention is to provide a method for manufacturing a molded body that uses the conductive member. [Solution] A conductive member includes: a base material; an intermediate layer disposed on at least one surface of the base material; a patterned layer to be plated that is disposed in a mesh shape on the intermediate layer and has a functional group interacting with a plating catalyst or a precursor thereof; a mesh-shaped metal layer that is disposed on the patterned layer to be plated and is formed by a plurality of thin metal wires intersecting; and a protective layer disposed on the metal layer. When the elastic modulus of the base material at 25°C is defined as a, and the elastic modulus of the intermediate layer at 25°C is defined as b, formula A is satisfied. Formula A: 0.010≤b/a≤0.500. The surface area of the metal layer is 0.2-60%, and the elastic modulus of the protective layer at 25°C is 0.10-5.00 GPa.
Inventors:
NARITA TAKESHI (JP)
Application Number:
PCT/JP2019/037746
Publication Date:
April 02, 2020
Filing Date:
September 26, 2019
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
B29C39/20; G06F3/041; B29C45/14; B32B3/24; B32B7/025; B32B15/02; B29K101/12; B29L9/00
Domestic Patent References:
| WO2018034291A1 | 2018-02-22 | |||
| WO2018047493A1 | 2018-03-15 | |||
| WO2018012203A1 | 2018-01-18 |
Foreign References:
| JP2018147855A | 2018-09-20 | |||
| JP2009006698A | 2009-01-15 | |||
| JP2011222797A | 2011-11-04 | |||
| JP2012238467A | 2012-12-06 | |||
| US20060103632A1 | 2006-05-18 |
Attorney, Agent or Firm:
ITOH Hideaki et al. (JP)
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