CONDUCTIVE MEMBER - SEKISUI POLYMATECH CO LTD

Title:

CONDUCTIVE MEMBER

Document Type and Number:

WIPO Patent Application WO/2021/075263

Kind Code:

A1

Abstract:

The purpose of the present invention is to reduce a pressing load on a conductive member for establishing a conductive connection. The conductive member 10 for conductively connecting a metal case with a circuit board has: a conductive substrate 11 in contact with the metal case; an elastic conductive film 13 having film bottom parts 13c serving as conduction parts for connecting with the conductive substrate 11 and in contact with the circuit board; and a base substrate 12 disposed between the conductive substrate 11 and the elastic conductive film 13. In addition, the elastic conductive film 13 can elastically deform with elastic deformation of the base substrate 12. Because of this configuration, the base substrate 12 is able to flexibly deform. Thus, the conductive member 10 can conductively connect the metal case with the circuit board with low load when being compressed therebetween.

Inventors:

KONNO HIDEAKI (JP)
ISHIKUBO MASAMICHI (JP)
IIMA AKARI (JP)
TAKEUCHI AKIHITO (JP)

Application Number:

PCT/JP2020/037181

Publication Date:

April 22, 2021

Filing Date:

September 30, 2020

Export Citation:

Click for automatic bibliography generation Help

Assignee:

SEKISUI POLYMATECH CO LTD (JP)

International Classes:

H01B7/06; H01R11/01

Foreign References:

JP2006134685A	2006-05-25
CN201011756Y	2008-01-23
CN204090426U	2015-01-07
JP2006180611A	2006-07-06
JP2009027065A	2009-02-05