CONDUCTIVE PAINT, METHOD FOR MANUFACTURING SHIELDED PACKAGE USING SAME, AND METHOD FOR MANUFACTURING RESIN MOLDED ARTICLE PROVIDED WITH SHIELD LAYER

Title:

CONDUCTIVE PAINT, METHOD FOR MANUFACTURING SHIELDED PACKAGE USING SAME, AND METHOD FOR MANUFACTURING RESIN MOLDED ARTICLE PROVIDED WITH SHIELD LAYER

Document Type and Number:

WIPO Patent Application WO/2021/014964

Kind Code:

A1

Abstract:

Provided is a conductive paint that is curable at 110°C or lower and has both excellent electrical conductivity and high adhesiveness.　The conductive paint comprises, per 100 parts by mass of a binder component (A) containing an epoxy resin, 1000-4000 parts by mass of metal particles (B), 50-150 parts by mass of a block isocyanate curing agent (C) and 200-1500 parts by mass of a solvent (D).

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Inventors:

NAKAZONO HAJIME (JP)
NISOGI MASAMICHI (JP)

Application Number:

PCT/JP2020/026574

Publication Date:

January 28, 2021

Filing Date:

July 07, 2020

Export Citation:

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Assignee:

TATSUTA ELECTRIC WIRE & CABLE CO LTD (JP)

International Classes:

C09D5/24; C09D7/61; C09D7/63; C09D163/00; H01B1/22; H01L21/56; H01L23/29; H01L23/31

Foreign References:

JP2011238596A	2011-11-24
JP2013196953A	2013-09-30
JP2011071057A	2011-04-07
JP2011100573A	2011-05-19
JP2017179362A	2017-10-05
JP2017179360A	2017-10-05

Attorney, Agent or Firm:

TSUTADA, Masato et al. (JP)

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