Title:
CONDUCTIVE PARTICLES AND CONNECTION STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2021/020501
Kind Code:
A1
Abstract:
Provided are conductive particles with which it is possible to effectively suppress occurrence of a connection failure. The conductive particles (1, 11, 21) according to the present invention are each provided with a base material particle (2) and a conductive part (3, 12, 22) disposed on the surface of the base material particle, wherein the conductive particles have a particle diameter of at least 30 μm, and the ratio of the resistance value (R20) of the conductive particles as measured after repeatedly subjecting the conductive particles to 20 rounds of placing and removing a load until the conductive particles underwent 20%-compressional deformation with respect to the resistance value (R1) of the conductive particles as measure after subjecting the conductive particles to only one round of placing and removing a load such that the conductive particles underwent 20%-compressional deformation, is 1.5 or less.
Inventors:
DOBASHI YUTO (JP)
Application Number:
PCT/JP2020/029209
Publication Date:
February 04, 2021
Filing Date:
July 30, 2020
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
H01B1/22; H01B5/00; H01R11/01
Domestic Patent References:
| WO2005059571A1 | 2005-06-30 |
Foreign References:
| JP2001237039A | 2001-08-31 | |||
| JP2010129455A | 2010-06-10 | |||
| JP2016012560A | 2016-01-21 |
Attorney, Agent or Firm:
MIYAZAKI & METSUGI (JP)
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