Title:
CONDUCTIVE PARTICLES, CONDUCTIVE MATERIAL, AND CONNECTION STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2020/251043
Kind Code:
A1
Abstract:
Provided are conductive particles that can effectively suppress occurrence of aggregation thereamongst. The conductive particles according to the present invention are each provided with a base material particle, and a conductive part disposed on the surface of the base material particle, wherein: the conductive part includes a component that enables metal diffusion at 400ºC or lower, or can be melted and deformed at 400ºC or lower; the conductive part includes solder parts; and the area proportion of a portion having the solder parts is 99% or less with respect to a total surface area proportion of 100% of the base material particle.
Inventors:
KURIURA RYOU (JP)
Application Number:
PCT/JP2020/023304
Publication Date:
December 17, 2020
Filing Date:
June 12, 2020
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
H01B1/00; H01B1/22; H01B5/00; H01B5/16; H01R11/01; H05K3/32
Foreign References:
| JP2018046010A | 2018-03-22 | |||
| JP2018045906A | 2018-03-22 |
Attorney, Agent or Firm:
MIYAZAKI & METSUGI (JP)
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