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Patent Searching and Data


Title:
CONDUCTIVE RESIN COMPOSITION AND MOLDED ARTICLE OBTAINED BY MOLDING THE SAME
Document Type and Number:
WIPO Patent Application WO/2008/018349
Kind Code:
A1
Abstract:
Disclosed are a conductive resin composition with reduced odor, and a molded article obtained by using such a resin composition. Specifically disclosed is a conductive resin composition obtained by blending 50-200 parts by weight of a stainless steel microfiber (D) and 0.1-5.0 parts by weight of a synthetic zeolite (E) represented by the formula (1) below per 100 parts by weight of a resin component (C) containing 50-92% by weight of a polyphenylene ether (A) and 50-8% by weight of a styrene resin (B). M2/nO Al2O3 xSiO2 yH2O (1) (In the formula, M represents an ion-exchangeable monovalent or divalent metal; n represents the valence of the metal; x represents a silica coefficient (SiO2/Al2O3 molar ratio), namely a number of 10-500; and y represents the number of crystal water, namely a number of 0-7.)

Inventors:
HOSHINO SATOSHI (JP)
MIZUTANI ZENPEI (JP)
Application Number:
PCT/JP2007/065128
Publication Date:
February 14, 2008
Filing Date:
August 02, 2007
Export Citation:
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Assignee:
MITSUBISHI ENG PLASTICS CORP (JP)
HOSHINO SATOSHI (JP)
MIZUTANI ZENPEI (JP)
International Classes:
C08L71/12; B65D1/34; C08K3/34; C08K7/06; C08L25/02
Foreign References:
JPH02265960A1990-10-30
JPH03153755A1991-07-01
JPH02178336A1990-07-11
JPH07138466A1995-05-30
JPS5461252A1979-05-17
JPH07179694A1995-07-18
JP2006257404A2006-09-28
Attorney, Agent or Firm:
SIKs & Co. (Kyobashi-Nisshoku Bldg.8-7, Kyobashi 1-chome, Chuo-ku, Tokyo 31, JP)
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