Title:
A CONNECTING ELEMENT FOR CONNECTING A CIRCUIT BOARD TO A HEAT SINK AND METHOD OF ESTABLISHING THE CONNECTION
Document Type and Number:
WIPO Patent Application WO/2021/091144
Kind Code:
A1
Abstract:
The invention, which relates to a connecting element (1) for connecting a circuit board (2) to a heat sink (3) and a method for establishing the connection, is intended to solve the problem of identifying a simple and inexpensive solution for dissipating the heat generated in SMD components (11) on a circuit board (2). This problem is solved by this arrangement in that a plurality of through connections (4) are arranged in the circuit board (2), in that the connecting element (1) has a main body (7) comprising several sides and contact elements (8), whereby the plurality of contact elements (8) is arranged on a first side (5) of the main body (7), and in that the plurality of contact elements (8) of the connecting element (1) are placed on the plurality of through connections (4) of the circuit board (2). Fig. 3
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Inventors:
BÖH MAGNUS (DE)
KARUTZ PHILIPP (DE)
WERKER STEPHAN (DE)
WAGENER VINCENT (DE)
KARUTZ PHILIPP (DE)
WERKER STEPHAN (DE)
WAGENER VINCENT (DE)
Application Number:
PCT/KR2020/014690
Publication Date:
May 14, 2021
Filing Date:
October 27, 2020
Export Citation:
Assignee:
HANON SYSTEMS (KR)
International Classes:
H05K7/20; H01R12/71; H05K1/02
Foreign References:
| KR20180060572A | 2018-06-07 | |||
| JPH09126670A | 1997-05-16 | |||
| JP2008041910A | 2008-02-21 | |||
| JP2013123011A | 2013-06-20 | |||
| US20080212287A1 | 2008-09-04 |
Attorney, Agent or Firm:
HONESTY & JR PARTNERS INTELLECTUAL PROPERTY LAW GROUP (KR)
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