CONNECTING STRUCTURE AND CONNECTING METHOD OF CIRCUIT

WIPO Patent Application WO/2005/066992

A1

A connecting structure of a plasma display panel (PDP) and a flexible printed board (FPC board) in which migration of the Ag electrode of the PDP is prevented, and a method for connecting the electrode of the PDP and the wiring terminal of the FPC board through anisotropic conductive adhesive (ACF) by heating/pressing using a pressure-bonding tool. Assuming the width of the pressure-bonding tool (40) is a, the width of the overlapped portion of the electrode (3) and the wiring terminal (12) is b, the distance from the FPC substrate-side edge of the pressure-bonding tool to the electrode end part is c, the distance from the FPC substrate side edge of the pressure-bonding tool to the end part of a coverlay (13) is d, the width of the ACF (20) after connection is e, the distance from the PDP-side edge of the pressure-bonding tool to the end part of the wiring terminal is f, and the average particle diameter of conductive particles contained in the ACF is m, heating/pressing is performed in the following positional-relation arrangement; a≥e≥b, c≥0, f≥0, d:m=20:1-200:1.

SAKAIRI MIKIO (JP)

PCT/JP2004/011815

July 21, 2005

August 18, 2004

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SONY CHEMICALS CORP (JP)
SAKAIRI MIKIO (JP)

G09F9/00; H01J9/02; H01J11/46; H01J11/48; H01J17/34; H05K1/14; H05K3/36; H05K3/32; (IPC1-7): H01J9/02; G09F9/00; H01J11/02; H05K1/14; H05K3/36

JPH1116502A	1999-01-22
JP2000299555A	2000-10-24
JP2003297516A	2003-10-17

TAJIME & TAJIME (New-Well-Ikuta Bldg. 26-28, Mita 1-chome, Tama-ku, Kawasaki-sh, Kanagawa 34, JP)

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