Title:
CONNECTION STRUCTURE OF DIELECTRIC WAVEGUIDE
Document Type and Number:
WIPO Patent Application WO/2018/189834
Kind Code:
A1
Abstract:
A structure for establishing an electrical connection between multilayered dielectric substrates provided with dielectric waveguides formed from a conductor pattern and vias in the lamination direction within the multilayered dielectric substrates, wherein at the side of the multilayered dielectric substrates where a choke structure is provided for establishing an electrical connection between the waveguides, vias that constitute a portion of a tube wall of the dielectric waveguides are arranged in a zigzag formation.
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Inventors:
YOSHIOKA HIDEHARU (JP)
MORIMOTO YASUO (JP)
YONEDA NAOFUMI (JP)
HIROTA AKIMICHI (JP)
HAMADA TOMOKAZU (JP)
HATATE TSUYOSHI (JP)
MORIMOTO YASUO (JP)
YONEDA NAOFUMI (JP)
HIROTA AKIMICHI (JP)
HAMADA TOMOKAZU (JP)
HATATE TSUYOSHI (JP)
Application Number:
PCT/JP2017/014997
Publication Date:
October 18, 2018
Filing Date:
April 12, 2017
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H01P1/04
Domestic Patent References:
WO2008053886A1 | 2008-05-08 |
Foreign References:
JP2011015044A | 2011-01-20 | |||
JPH10224101A | 1998-08-21 | |||
JP5349196B2 | 2013-11-20 | |||
JP5094871B2 | 2012-12-12 | |||
US3155923A | 1964-11-03 | |||
JP5289408B2 | 2013-09-11 |
Other References:
See also references of EP 3605722A4
Attorney, Agent or Firm:
SOGA, Michiharu et al. (JP)
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