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Patent Searching and Data


Title:
CONNECTION STRUCTURE OF DIELECTRIC WAVEGUIDE
Document Type and Number:
WIPO Patent Application WO/2018/189834
Kind Code:
A1
Abstract:
A structure for establishing an electrical connection between multilayered dielectric substrates provided with dielectric waveguides formed from a conductor pattern and vias in the lamination direction within the multilayered dielectric substrates, wherein at the side of the multilayered dielectric substrates where a choke structure is provided for establishing an electrical connection between the waveguides, vias that constitute a portion of a tube wall of the dielectric waveguides are arranged in a zigzag formation.

Inventors:
YOSHIOKA HIDEHARU (JP)
MORIMOTO YASUO (JP)
YONEDA NAOFUMI (JP)
HIROTA AKIMICHI (JP)
HAMADA TOMOKAZU (JP)
HATATE TSUYOSHI (JP)
Application Number:
PCT/JP2017/014997
Publication Date:
October 18, 2018
Filing Date:
April 12, 2017
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H01P1/04
Domestic Patent References:
WO2008053886A12008-05-08
Foreign References:
JP2011015044A2011-01-20
JPH10224101A1998-08-21
JP5349196B22013-11-20
JP5094871B22012-12-12
US3155923A1964-11-03
JP5289408B22013-09-11
Other References:
See also references of EP 3605722A4
Attorney, Agent or Firm:
SOGA, Michiharu et al. (JP)
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