Title:
CONNECTION SUBSTRATE, INFORMATION PROCESSING DEVICE, AND PROTECTION METHOD FOR ELECTRONIC CIRCUIT
Document Type and Number:
WIPO Patent Application WO/2021/199510
Kind Code:
A1
Abstract:
A connection substrate that connects a first electronic component and a second electronic component. The connection substrate comprises: a first flexible substrate that comprises an electronic circuit to be protected; and a second flexible substrate that encloses the electronic circuit. The first flexible substrate comprises a first contact point, and the second flexible substrate comprises a second contact point. The second flexible substrate can enclose the electronic circuit, and when the second flexible substrate has enclosed the electronic circuit, the first contact point and the second contact point are positioned inside the second flexible substrate and can contact each other.
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Inventors:
SASAKI TAKEYUKI
KIDA KYOHEI
KIDA KYOHEI
Application Number:
PCT/JP2020/046594
Publication Date:
October 07, 2021
Filing Date:
December 14, 2020
Export Citation:
Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
G06K7/00; G06F1/16; G06F1/18; G06F21/86; H05K7/14
Foreign References:
| JP2016163947A | 2016-09-08 | |||
| JP2017094609A | 2017-06-01 | |||
| JPH0595174A | 1993-04-16 | |||
| JP2001195307A | 2001-07-19 |
Attorney, Agent or Firm:
Eikoh Patent Firm, P.C. (JP)
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