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Patent Searching and Data


Title:
CONNECTION TERMINAL UNIT
Document Type and Number:
WIPO Patent Application WO/2019/150950
Kind Code:
A1
Abstract:
The purpose of the present invention is to realize a connection terminal unit which can be adequately connected to a terminal connection part of a semiconductor module that includes a semiconductor element, and with which it is possible to reduce the projection area as viewed in a direction orthogonal to a direction along a chip surface. A connection terminal unit (1) provided with a plurality of connection terminals (25) that face toward and are connected to a plurality of terminal connection parts (55) of a semiconductor module (5), and a terminal mold part (20) for holding the connection terminals (25). The terminal mold part (20) has a contact part (T) that comes into contact with the semiconductor module (5) or a substrate (B) for supporting the semiconductor module (5). The contact part (T) has: vertical contact parts (1a) that make contact from a vertical direction (V), which is the direction in which the connection terminals (25) face the terminal connection parts (55); and side contact parts (1b, 1c) that make contact from at least two mutually different directions that intersect the vertical direction (V).

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Inventors:
HOTTA YUTAKA (JP)
OSUKA SHINYA (JP)
KUME YASUHIRO (JP)
Application Number:
PCT/JP2019/001095
Publication Date:
August 08, 2019
Filing Date:
January 16, 2019
Export Citation:
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Assignee:
AISIN AW CO (JP)
AISIN SEIKI (JP)
International Classes:
H01L23/48; H01L25/07; H01L25/18; H01R12/71; H05K1/14; H05K7/14
Domestic Patent References:
WO2015045648A12015-04-02
Foreign References:
JPH05259334A1993-10-08
JPS50125072U1975-10-14
JPH0385655U1991-08-29
JP2017050326A2017-03-09
JP2017208382A2017-11-24
JP2010176922A2010-08-12
JP2010160916A2010-07-22
JP2011253942A2011-12-15
Other References:
See also references of EP 3726574A4
Attorney, Agent or Firm:
R&C IP LAW FIRM (JP)
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