Title:
CONNECTOR
Document Type and Number:
WIPO Patent Application WO/2014/061202
Kind Code:
A1
Abstract:
Provided is a connector that enables electrical connectivity to be reliably maintained between the inside and the outside of a chamber while keeping the chamber interior airtight even if a through-hole formed in a substrate is not filled with a conductor, and that makes it possible to reduce the area where a member of the connector is to be connected. A connector (1) is provided with: a planar substrate (10) for blocking an opening (61) of a partition wall (60); through-holes (15) for forming an electrical interconnection between an inner surface layer (10a) and an outer surface layer (10b) of the substrate (10); and metallic conductors (22, 32) disposed so as to block the pass-through openings (13) of the though-holes (15) on an inner surface (10a) and/or an outer surface (10b) of the substrate (10), and connected to an electroconductive plating (14).
Inventors:
HASHIMOTO SHINICHI (JP)
Application Number:
PCT/JP2013/005579
Publication Date:
April 24, 2014
Filing Date:
September 20, 2013
Export Citation:
Assignee:
TYCO ELECTRONICS JAPAN G K (JP)
International Classes:
H01R11/01; H01R9/16; H01R12/71; H01R13/22; H01R13/533
Domestic Patent References:
WO2012144326A1 | 2012-10-26 |
Foreign References:
JPH1140223A | 1999-02-12 | |||
JPS6372863U | 1988-05-16 | |||
JP2009093806A | 2009-04-30 | |||
JP2004349073A | 2004-12-09 | |||
JP2013012408A | 2013-01-17 |
Attorney, Agent or Firm:
MORI, Tetsuya et al. (JP)
Woods Tetsuya (JP)
Woods Tetsuya (JP)
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