Title:
CONSTRUCTIONAL HEAT-INSULATING FOAM BOARD AND PROCESS FOR PRODUCTION THEREOF
Document Type and Number:
WIPO Patent Application WO/2007/004524
Kind Code:
A1
Abstract:
The invention provides a constructional heat-insulating foam board of a polyolefin resin composition which exhibits excellent extrusion foamability and excellent heat insulation performance and which is recyclable and can be produced at a low cost continuously and stably. A constructional heat-insulating foam board, characterized by being produced by expanding a polyolefin resin composition containing a linear polypropylene resin exhibiting a melt tension of 5 to 30g at 230ºC with a blowing agent containing supercritical carbon dioxide as the essential component at an expansion ratio of 10 or above.
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Inventors:
OONO KATSUAKI (JP)
ITAYA TORU (JP)
SUGAWARA MINORU (JP)
OTSUKI YASUHIKO (JP)
ZHANG CHUNXIAO (JP)
BABA KAZUHIRO (JP)
ITAYA TORU (JP)
SUGAWARA MINORU (JP)
OTSUKI YASUHIKO (JP)
ZHANG CHUNXIAO (JP)
BABA KAZUHIRO (JP)
Application Number:
PCT/JP2006/313028
Publication Date:
January 11, 2007
Filing Date:
June 29, 2006
Export Citation:
Assignee:
ASAHI FIBREGLASS CO (JP)
PRIME POLYMER CO LTD (JP)
KAWATA MFG (JP)
OONO KATSUAKI (JP)
ITAYA TORU (JP)
SUGAWARA MINORU (JP)
OTSUKI YASUHIKO (JP)
ZHANG CHUNXIAO (JP)
BABA KAZUHIRO (JP)
PRIME POLYMER CO LTD (JP)
KAWATA MFG (JP)
OONO KATSUAKI (JP)
ITAYA TORU (JP)
SUGAWARA MINORU (JP)
OTSUKI YASUHIKO (JP)
ZHANG CHUNXIAO (JP)
BABA KAZUHIRO (JP)
International Classes:
C08J9/12; B29C48/07; B29C48/305; B29K23/00; B29K105/04; B29L7/00
Foreign References:
| JP2003147110A | 2003-05-21 | |||
| JP2001348452A | 2001-12-18 |
Attorney, Agent or Firm:
SENMYO, Kenji et al. (38 Kanda-Higashimatsushitach, Chiyoda-ku Tokyo 42, JP)
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