Title:
CONTACT FOR TESTING SEMICONDUCTOR DEVICE, AND TEST SOCKET DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/221777
Kind Code:
A1
Abstract:
The present invention relates to a contact and a socket device for testing a semiconductor device, and the contact of the present invention is a spring contact integrally formed by punching and bending a metal plate, and comprises an elastic part, which includes various strips of a predetermined pattern, and tip parts, which are respectively provided at both ends of the elastic part, and, preferably, is filled with a filler having conductivity and elasticity in a space volume, thereby having excellent durability and electrical characteristics. In addition,a test socket according to the present invention is a rubber type employing the contact and has an effect suitable for testing a fine-pitch device.
Inventors:
HWANG JAE SUK (US)
Application Number:
PCT/KR2017/006628
Publication Date:
December 06, 2018
Filing Date:
June 23, 2017
Export Citation:
Assignee:
HWANG DONG WEON (KR)
HICON CO LTD (KR)
HWANG JAE SUK (US)
HWANG JAE BAEK (KR)
HICON CO LTD (KR)
HWANG JAE SUK (US)
HWANG JAE BAEK (KR)
International Classes:
G01R1/067; B21D11/06; G01R31/28
Foreign References:
| KR20160085457A | 2016-07-18 | |||
| KR20120031493A | 2012-04-03 | |||
| JP2016223996A | 2016-12-28 | |||
| JP2013205191A | 2013-10-07 | |||
| KR101457168B1 | 2014-11-04 | |||
| KR101266123B1 | 2013-05-27 |
Attorney, Agent or Firm:
LEE, Un Cheol (KR)
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