Title:
CONTROL SYSTEM FOR CONTROLLING POLISHING DEVICE FOR POLISHING SUBSTRATE, AND POLISHING METHOD
Document Type and Number:
WIPO Patent Application WO/2020/184078
Kind Code:
A1
Abstract:
Provided are a control system having an improved yield, for controlling a polishing device, and a polishing method. A defect data receiving portion 112 of a control system 102 receives defect data relating to a defect of a substrate. A processing data receiving portion 114 receives processing data relating to the content of processing of the substrate by a polishing device 1000. A defect occurrence cause identifying portion 116 identifies a cause of occurrence of the defect on the basis of the defect data and the processing data. A defect correcting measure portion 118 determines a defect correcting measure for correcting the defect, with regard to the identified occurrence cause, and instructs at least one of a polishing unit 300, a washing unit 400, and an EFEM 200 to carry out the defect correcting measure.
Inventors:
TAKEDA KOICHI (JP)
Application Number:
PCT/JP2020/006176
Publication Date:
September 17, 2020
Filing Date:
February 18, 2020
Export Citation:
Assignee:
EBARA CORP (JP)
International Classes:
B24B49/02; H01L21/304
Foreign References:
| JP2015185571A | 2015-10-22 | |||
| JP2012199348A | 2012-10-18 | |||
| JP2017003358A | 2017-01-05 |
Attorney, Agent or Firm:
MIYAMAE, Toru et al. (JP)
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