Title:
CONVEYANCE DEVICE, CONVEYANCE METHOD, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/163783
Kind Code:
A1
Abstract:
A conveyance device according to the present embodiment conveys a substrate (100) in order to irradiate, onto the substrate (100), a laser beam forming a linear irradiation region (15a). The conveyance device comprises: a floating unit (10) for floating the substrate on an upper surface thereof; a holding mechanism (12) for holding the substrate (100); and a movement mechanism (13) for moving the holding mechanism (12) in a direction inclined from a direction orthogonal to the longitudinal direction of the linear laser beam in a top view so as to change the irradiation position of the laser beam with respect to the substrate (100).
Inventors:
YAMAGUCHI YOSHIHIRO (JP)
FUJI TAKAHIRO (JP)
IMAMURA HIROAKI (JP)
FUJI TAKAHIRO (JP)
IMAMURA HIROAKI (JP)
Application Number:
PCT/JP2022/003187
Publication Date:
August 04, 2022
Filing Date:
January 27, 2022
Export Citation:
Assignee:
JSW AKTINA SYSTEM CO LTD (JP)
International Classes:
H01L21/20; H01L21/268; H01L21/336; H01L21/683; H01L29/786
Foreign References:
| JP2018157000A | 2018-10-04 | |||
| JPH10242073A | 1998-09-11 | |||
| JP2006216971A | 2006-08-17 | |||
| JP2019121754A | 2019-07-22 | |||
| JP2008147291A | 2008-06-26 | |||
| JPH11243057A | 1999-09-07 |
Attorney, Agent or Firm:
IEIRI Takeshi (JP)
Download PDF: