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Patent Searching and Data


Title:
COOLING BLOCK AND RUNNERLESS INJECTION MOLDING DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/043038
Kind Code:
A1
Abstract:
A cooling block (30) that has formed therein: a resin flow path (31) that is a flow path for a heat-curable resin (11); and a cooling flow path (32) that is arranged around the resin flow path (31) and has a cooling material (33) flowing therethrough. The cooling block (30) is configured such that the cooling flow path (32) comprises a plurality of unit coil sections (323a) that are coiled around the resin flow path (31). The pitch (A) between at least one pair of adjacent unit coil sections (323a) from among the plurality of unit coil sections (323a) is 1.5-8.0 mm. The shortest distance B between the plurality of unit coil sections (323a) and the second sprue (31) is 1.0-5.0 mm.

Inventors:
IMAIZUMI MASAHIKO
TANAKA KENICHI
Application Number:
PCT/JP2017/028516
Publication Date:
March 08, 2018
Filing Date:
August 07, 2017
Export Citation:
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Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
B29C45/26; B29C33/04
Foreign References:
JPS5586728A1980-06-30
JPS5331065U1978-03-17
JPH07137038A1995-05-30
Attorney, Agent or Firm:
KAMATA Kenji et al. (JP)
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