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Title:
COOLING DEVICE AND METHOD FOR MANUFACTURING COOLING DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/067894
Kind Code:
A1
Abstract:
Provided is a cooling device in which a first heat-dissipating fin row (21) and a second heat-dissipating fin row (22) are alternately arranged. A first heat-dissipating fin height (2111) is different from a second heat-dissipating fin height (2211). The first heat-dissipating fin height (2111) is a height such that, in a state in which a tool (5) having a downwardly tapering shape is in contact with a heat-dissipating surface (11) to form the second heat-dissipating fin row (22), an upper part of the tool (5) having a greater horizontal width than a lower part thereof does not contact the first heat-dissipating fin row (21).

Inventors:
ASAI KYOTA (JP)
TOKUYAMA TAKESHI (JP)
NAMBA AKIHIRO (JP)
CHEN TI (JP)
Application Number:
PCT/JP2022/032071
Publication Date:
April 27, 2023
Filing Date:
August 25, 2022
Export Citation:
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Assignee:
HITACHI LTD (JP)
International Classes:
H01L23/36; H05K7/20
Foreign References:
US20120061816A12012-03-15
JP2012216711A2012-11-08
JP2014209614A2014-11-06
JPH06302638A1994-10-28
JP2008098432A2008-04-24
Attorney, Agent or Firm:
KAICHI IP (JP)
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