Title:
COOLING DEVICE
Document Type and Number:
WIPO Patent Application WO/2015/033689
Kind Code:
A1
Abstract:
The present invention provides a cooling device that has high efficiency and a high degree of freedom of changes in shape, and that does not require electrical power. The cooling device is characterized by comprising a resin and a ceramic material having latent heat, and by having a sheet shape.
More Like This:
| WO/2020/050334 | HEAT CONDUCTIVE SHEET |
| JP5896400 | Diamond-containing heat sink material and its manufacturing method |
| JP2017028040 | SEMICONDUCTOR DEVICE |
Inventors:
HIROSE SAKYO (JP)
Application Number:
PCT/JP2014/069474
Publication Date:
March 12, 2015
Filing Date:
July 23, 2014
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L23/373; C04B35/00; C09K5/08; F28F21/04; H05K7/20
Foreign References:
| JP2010080173A | 2010-04-08 | |||
| JP2010163510A | 2010-07-29 | |||
| JP2013084710A | 2013-05-09 |
Attorney, Agent or Firm:
SAMEJIMA, Mutsumi et al. (JP)
Mutsumi Sameshima (JP)
Mutsumi Sameshima (JP)
Download PDF: