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Patent Searching and Data


Title:
COOLING DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/152822
Kind Code:
A1
Abstract:
This cooling device (1) is provided with: a heat-receiving block (11) to which a heating element (31) is attached; a first heat pipe (12) fixed to the heat-receiving block (11); and a second heat pipe (13) adjacent to the first heat pipe (12). A first coolant (15) is sealed in the first heat pipe (12) in gas-liquid two-phase state, and a second coolant (16) is sealed in the second heat pipe (13) in gas-liquid two-phase state. The fraction occupied by the liquid-state second coolant (16) in the volume of the second heat pipe (13) is larger than the fraction occupied by the liquid-state first coolant (15) in the volume of the first heat pipe (12).

Inventors:
NAKASHIMA YUKIO (JP)
USHIFUSA HIROYUKI (JP)
Application Number:
PCT/JP2019/002247
Publication Date:
July 30, 2020
Filing Date:
January 24, 2019
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H01L23/427; F28D15/02; H05K7/20
Domestic Patent References:
WO2016104729A12016-06-30
Foreign References:
JP3020790B22000-03-15
JP2016205745A2016-12-08
JP2012184913A2012-09-27
JP2014159915A2014-09-04
JP2012013373A2012-01-19
JPS52116950A1977-09-30
JP2005032771A2005-02-03
Attorney, Agent or Firm:
KIMURA Mitsuru (JP)
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