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Title:
COOLING MODULE HAVING AIRFLOW CHANNELS, AND AIR CONDITIONER DEVICE HAVING SAME
Document Type and Number:
WIPO Patent Application WO/2020/252680
Kind Code:
A1
Abstract:
A cooling module having airflow channels, and an air conditioner device having same. The cooling module comprises: a cooling chip (11) having a cold production surface (11a) for producing a low temperature and a heat production surface (11b) for producing a high temperature; a high-temperature conduction structure (12), substantively contacting the heat production surface (11b) and internally accommodating a flowable heat exchange fluid, the heat exchange fluid being discharged from the high-temperature conduction structure (12) and cooled, and the cooled heat exchange fluid being further transported back into the high-temperature conduction structure (12); and a low-temperature conduction structure (13), having one side substantively attached to the cold production surface (11a) and having a plurality of airflow channels (135) for air to pass through, the low temperature of the cold production surface (11a) being directly conducted on the surfaces of the airflow channels (135) and then being further transferred within the airflow channels (135) in a heat radiation mode.

Inventors:
LIN SHIH-SHUAN (CN)
Application Number:
PCT/CN2019/091833
Publication Date:
December 24, 2020
Filing Date:
June 19, 2019
Export Citation:
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Assignee:
LIN SHIH SHUAN (CN)
International Classes:
F24F5/00; F25B21/02
Foreign References:
CN101319808A2008-12-10
CN200961920Y2007-10-17
CN2665624Y2004-12-22
CN101329096A2008-12-24
CN101625178A2010-01-13
JP2001108326A2001-04-20
US6418728B12002-07-16
Attorney, Agent or Firm:
CHINA LONGRIVER PATENT & TRADEMARK OFFICE (GENERAL PARTNERSHIP) (CN)
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