Title:
COPPER ALLOY BAR, PRODUCTION METHOD FOR COPPER ALLOY BAR, RESISTOR RESISTIVE MATERIAL USING COPPER ALLOY BAR, AND RESISTOR
Document Type and Number:
WIPO Patent Application WO/2020/196791
Kind Code:
A1
Abstract:
This copper alloy bar has a composition that contains 3–20 mass% of manganese (Mn), the remainder comprising copper (Cu) and unavoidable impurities. The copper alloy bar is characterized in that the ratio (the surface layer [Mn/Cu] ratio) of Mn content to Cu content as measured by Auger electron spectroscopy for a surface layer region that is demarcated by the surface of the copper alloy bar and locations 0.05 μm from the surface in the depth direction is less than 0.030 in terms of mass. The copper alloy bar has stable resistance, even if the ambient temperature changes, and has favorable solder mountability.
Inventors:
KAWATA SHINGO (JP)
AKIYA SHUNTA (JP)
HIGUCHI MASARU (JP)
AKIYA SHUNTA (JP)
HIGUCHI MASARU (JP)
Application Number:
PCT/JP2020/013832
Publication Date:
October 01, 2020
Filing Date:
March 26, 2020
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
International Classes:
C22C9/02; C22C9/04; C22C9/05; C22C9/06; C22F1/08; H01C13/00; C22F1/00
Domestic Patent References:
| WO2018150705A1 | 2018-08-23 | |||
| WO2019244842A1 | 2019-12-26 |
Foreign References:
| JP2016069724A | 2016-05-09 | |||
| JP2012020325A | 2012-02-02 | |||
| US20180130578A1 | 2018-05-10 | |||
| JP2000256775A | 2000-09-19 |
Attorney, Agent or Firm:
SAITO Takuya et al. (JP)
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