Title:
COPPER-CATALYZED FORMATION OF CARBON-HETEROATOM AND CARBON-CARBON BONDS
Document Type and Number:
WIPO Patent Application WO2004013094
Kind Code:
A3
Abstract:
One aspect of the present invention relates to copper-catalyzed carbon-heteroatom and carbon-carbon bond-forming methods. In certain embodiments, the present invention relates to copper-catalyzed methods of forming a carbon-sulfur bond between the sulfur atom of a thiol moiety and the activated carbon of an aryl, heteroaryl, or vinyl halide or sulfonate. In other embodiments, the present invention relates to copper(II)-catalyzed methods of forming a carbon-nitrogen bond between the nitrogen atom of an amide and the activated carbon of an aryl, heteroaryl, or vinyl halide or sulfonate. In certain embodiments, the present invention relates to copper-catalyzed methods of forming a carbon-carbon bond between the carbon atom of cyanide ion and the activated carbon of an aryl, heteroaryl, or vinyl halide or sulfonate. In another embodiment, the present invention relates to a copper-catalyzed method of transforming and aryl, heteroaryl, or vinyl iodide. Yet another embodiment of the present invention relates to a tandem method, which may be practiced in a single reaction vessel, wherein the first step of the method involves the copper-catalyzed formation of an aryl, heteroaryl, or vinyl iodide from the corresponding aryl, heteroaryl, or vinyl chloride or bromide; and the second step of the method involves the copper-catalyzed formation of an aryl, heteroaryl, or vinyl nitrile, amide or sulfide from the aryl, heteroaryl, or vinyl iodide formed in the first step.
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Inventors:
BUCHWALD STEPHEN L
KLAPARS ARTIS
KWONG FUK Y
STREITER ERIC
ZANON JACOPO
KLAPARS ARTIS
KWONG FUK Y
STREITER ERIC
ZANON JACOPO
Application Number:
PCT/US2003/023924
Publication Date:
August 26, 2004
Filing Date:
July 31, 2003
Export Citation:
Assignee:
MASSACHUSETTS INST TECHNOLOGY (US)
International Classes:
C07B39/00; C07D333/38; C07B61/00; C07C17/20; C07C21/17; C07C25/02; C07C25/18; C07C45/63; C07C49/807; C07C51/363; C07C57/60; C07C67/307; C07C69/612; C07C201/12; C07C205/12; C07C231/12; C07C233/15; C07C253/14; C07C253/30; C07C255/35; C07C255/50; C07C255/52; C07C255/53; C07C255/54; C07C255/55; C07C255/56; C07C255/58; C07C255/60; C07C303/40; C07C311/16; C07C319/14; C07C321/28; C07C321/30; C07C323/09; C07C323/20; C07C323/22; C07C323/37; C07C323/56; C07D207/267; C07D209/08; C07D213/38; C07D213/70; C07D213/73; C07D213/85; C07D215/18; C07D215/54; C07D231/14; C07D271/10; C07D271/107; C07D307/68; C07D333/62; C07D333/68; C07C255/57; C07C323/12; C07C323/32; C07C323/62; (IPC1-7): C07C319/14
Foreign References:
| US4449004A | 1984-05-15 | |||
| US5266727A | 1993-11-30 |
Other References:
See also references of EP 1534671A4
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