Title:
COPPER-CLAD LAMINATED BOARD, PRINTED CIRCUIT BOARD, AND FABRICATION METHOD FOR PRINTED CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2021/031250
Kind Code:
A1
Abstract:
Provided in the present invention is a copper-clad laminated board, comprising an insulating substrate and a copper foil layer that covers the surface of the insulating substrate, wherein the insulating substrate comprises at least one first insulating layer, and the first insulating layer is a blend jointly formed by resin and a surface fiber felt made of fibers, or a blend jointly formed by a non-woven fabric reinforced composite material and resin; and the copper foil layer is attached to the outer surface of the first insulating layer. Also provided in the present invention is a printed circuit board, which is made from the copper-clad laminated board according to the present invention. Also provided in the present invention is a fabrication method for the printed circuit board. Compared to related technology, the copper-clad laminated board and the printed circuit board according to the present invention have excellent dielectric properties.
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Inventors:
WANG HONGYUAN (CN)
WANG HEZHI (CN)
WANG HEZHI (CN)
Application Number:
PCT/CN2019/104827
Publication Date:
February 25, 2021
Filing Date:
September 09, 2019
Export Citation:
Assignee:
AAC ACOUSTIC TECH SHENZHEN CO LTD (CN)
AAC TECH NANJING CO LTD (CN)
AAC TECH NANJING CO LTD (CN)
International Classes:
B32B17/04; B32B15/14; H05K1/03
Foreign References:
| CN110561857A | 2019-12-13 | |||
| CN102304271A | 2012-01-04 | |||
| CN102190865A | 2011-09-21 | |||
| US3741858A | 1973-06-26 |
Attorney, Agent or Firm:
GUAGDONG GUANGHE LAW FIRM (CN)
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