Title:
COPPER-COATED ALUMINUM WIRE MATERIAL AND PRODUCTION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2022/190942
Kind Code:
A1
Abstract:
The problem addressed by the present invention is to provide a copper-coated aluminum wire material with a reduced weight and excellent adhesiveness, and a production method therefor. This copper-coated aluminum wire material is provided with an aluminum wire material comprising aluminum or an aluminum alloy and a thin copper film covering the aluminum wire material. The space factor of the thin copper film is in the range of 0.2% to 4% and the adhesiveness between the aluminum wire material and the thin copper film based on a scratch test compliant with JIS R 3255 is at least 10 mN.
Inventors:
KIKUCHI AKIHIRO (JP)
KITAGUCHI HITOSHI (JP)
IIJIMA YASUO (JP)
HIRATA KAZUTO (JP)
KITAGUCHI HITOSHI (JP)
IIJIMA YASUO (JP)
HIRATA KAZUTO (JP)
Application Number:
PCT/JP2022/008429
Publication Date:
September 15, 2022
Filing Date:
February 28, 2022
Export Citation:
Assignee:
NAT INST MATERIALS SCIENCE (JP)
International Classes:
C23C10/28; B21C1/00; H01B1/02; H01B5/02; H01B13/00
Domestic Patent References:
| WO2019193960A1 | 2019-10-10 |
Foreign References:
| JPH05285690A | 1993-11-02 | |||
| JP2005248318A | 2005-09-15 | |||
| JPS621850A | 1987-01-07 |
Attorney, Agent or Firm:
ASAMURA PATENT OFFICE, P.C. (JP)
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