COPPER PASTE FOR JOINING, METHOD FOR MANUFACTURING JOINED BODY, AND JOINED BODY

Title:

COPPER PASTE FOR JOINING, METHOD FOR MANUFACTURING JOINED BODY, AND JOINED BODY

Document Type and Number:

WIPO Patent Application WO/2021/066026

Kind Code:

A1

Abstract:

A copper paste for joining, containing: copper particles; a polycarboxylic acid having a melting point of no more than 120°C; and a carrier fluid. A method for manufacturing a joined body, comprising: a first step in which a laminate is prepared that has a first member, the copper paste for joining and a second member, laminated in said order; and a second step in which the laminate is heated and the copper paste for joining is sintered, in a gas atmosphere having a hydrogen concentration of no more than 45%. The joined body comprises the first member, the second member, and the sintered body of the copper paste for joining which joins the first member and the second member.

Inventors:

KAWANA YUKI (JP)
EJIRI YOSHINORI (JP)
NAKAKO HIDEO (JP)
NATORI MICHIKO (JP)
NEGISHI MOTOHIRO (JP)
ISHIKAWA DAI (JP)
SUGAMA CHIE (JP)

Application Number:

PCT/JP2020/037198

Publication Date:

April 08, 2021

Filing Date:

September 30, 2020

Export Citation:

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Assignee:

SHOWA DENKO MATERIALS CO LTD (JP)

International Classes:

B22F1/00; B22F7/04; B22F9/00; H01B1/00; H01B1/22; H01L21/52; H01L21/60; H01L23/12; H01L23/48; H05K1/09; H05K3/32

Domestic Patent References:

WO2019093121A1	2019-05-16
WO2018168187A1	2018-09-20

Foreign References:

JP2018170228A	2018-11-01
JP2018107421A	2018-07-05
JP2019055414A	2019-04-11
JP2017119291A	2017-07-06
JP2017130623A	2017-07-27
JP2013221143A	2013-10-28
JP2019057691A	2019-04-11
US20160351529A1	2016-12-01

Other References: