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Patent Searching and Data


Title:
COPPER PASTE FOR JOINING, METHOD FOR MANUFACTURING JOINED BODY, AND JOINED BODY
Document Type and Number:
WIPO Patent Application WO/2021/066026
Kind Code:
A1
Abstract:
A copper paste for joining, containing: copper particles; a polycarboxylic acid having a melting point of no more than 120°C; and a carrier fluid. A method for manufacturing a joined body, comprising: a first step in which a laminate is prepared that has a first member, the copper paste for joining and a second member, laminated in said order; and a second step in which the laminate is heated and the copper paste for joining is sintered, in a gas atmosphere having a hydrogen concentration of no more than 45%. The joined body comprises the first member, the second member, and the sintered body of the copper paste for joining which joins the first member and the second member.

Inventors:
KAWANA YUKI (JP)
EJIRI YOSHINORI (JP)
NAKAKO HIDEO (JP)
NATORI MICHIKO (JP)
NEGISHI MOTOHIRO (JP)
ISHIKAWA DAI (JP)
SUGAMA CHIE (JP)
Application Number:
PCT/JP2020/037198
Publication Date:
April 08, 2021
Filing Date:
September 30, 2020
Export Citation:
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Assignee:
SHOWA DENKO MAT CO LTD (JP)
International Classes:
B22F1/00; B22F7/04; B22F9/00; H01B1/00; H01B1/22; H01L21/52; H01L21/60; H01L23/12; H01L23/48; H05K1/09; H05K3/32
Domestic Patent References:
WO2019093121A12019-05-16
WO2018168187A12018-09-20
Foreign References:
JP2018170228A2018-11-01
JP2018107421A2018-07-05
JP2019055414A2019-04-11
JP2017119291A2017-07-06
JP2017130623A2017-07-27
JP2013221143A2013-10-28
JP2019057691A2019-04-11
US20160351529A12016-12-01
Other References:
See also references of EP 4023363A4
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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