COUPLER AND MANUFACTURING METHOD THEREFOR

WIPO Patent Application WO/2021/042249

A1

A coupler (100) and a manufacturing method therefor. The coupler (100) comprises: a top core layer (11), an intermediate core layer and a bottom core layer (17); the intermediate core layer is stacked with the top core layer (11) and the bottom core layer (17) by means of corresponding dielectric layers (12, 16) respectively; the intermediate core layer is of a multilayer structure, and comprises a first inner core layer (13) and a second inner core layer (15), the first inner core layer (13) comprising a first signal line (132) and a second signal line (133) which are provided on two opposite surfaces, and the second inner core layer (15) comprising a third signal line (152) and a fourth signal line (153) which are provided on two opposite surfaces; the first signal line (132) is connected to the third signal line (152) to form a first coupling line, and the second signal line (133) is connected to the fourth signal line (153) to form a second coupling line; an isolation layer (141) is provided between the first inner core layer (13) and the second inner core layer (15), so as to isolate signals between signal lines of different layers on the same coupling line, thereby improving the performance index of the coupler (100).

WO/1988/008211	BROAD BAND COUPLER
JPS5941608	[Title of the device] Multi stage high frequency joint machine

CHEN YUAN (CN)
LUO LIN (CN)
YE XIAOJING (CN)
MIAO HUA (CN)

PCT/CN2019/104070

March 11, 2021

September 02, 2019

Click for automatic bibliography generation  

SHENNAN CIRCUITS CO LTD (CN)

H01P5/16

CN207265210U	2018-04-20
CN1519867A	2004-08-11
CN106714475A	2017-05-24
CN207733057U	2018-08-14
JP2010011519A	2010-01-14
JP2015162729A	2015-09-07

CHINA WISPRO INTELLECTUAL PROPERTY LLP. (CN)

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