Title:
COVER MEMBER, DOUBLE-SIDED ADHESIVE SHEET, SEAL MEMBER, AND SHEET FOR SUPPLYING MEMBER
Document Type and Number:
WIPO Patent Application WO/2023/033089
Kind Code:
A1
Abstract:
The present invention provides a cover member suited to preventing damage to a semiconductor element package caused by an increase in internal pressure. The provided cover member comprises: a cover sheet having a shape that covers a target object when arranged on an arrangement surface; and an adhesive layer that is joined to the cover sheet and fixes the cover member to the arrangement surface. The adhesive layer includes a double-sided adhesive sheet. The double-sided adhesive sheet has a structure in which a first adhesive layer, a base material, and a second adhesive layer are layered in this order. The base material has a porous structure. The porosity of the base material is at least 30%, and (1) when the porosity of the base material is 30-50%, the average hole diameter of the base material is 10 μm or greater, and (2) when the porosity of the base material exceeds 50%, the average hole diameter is 0.05 μm or greater.
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Inventors:
ISHII KYOKO (JP)
SUGAYA YOSUKE (JP)
INOUE TAKEO (JP)
KONTANI TOMOHIRO (JP)
YAKUWA SHIMPEI (JP)
IMAMURA SHUNJI (JP)
SUGAYA YOSUKE (JP)
INOUE TAKEO (JP)
KONTANI TOMOHIRO (JP)
YAKUWA SHIMPEI (JP)
IMAMURA SHUNJI (JP)
Application Number:
PCT/JP2022/032885
Publication Date:
March 09, 2023
Filing Date:
August 31, 2022
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
H01L23/02; C09J7/26; C09J7/38; C09J133/04; C09J183/04; H01L23/10
Domestic Patent References:
| WO2021112197A1 | 2021-06-10 |
Foreign References:
| JP2019026824A | 2019-02-21 | |||
| JP2011157476A | 2011-08-18 | |||
| JP2013190496A | 2013-09-26 | |||
| JP2015044888A | 2015-03-12 |
Attorney, Agent or Firm:
KAMADA Koichi (JP)
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