Title:
COVER TAPE FOR PACKAGING ELECTRONIC COMPONENT AND PACKAGE
Document Type and Number:
WIPO Patent Application WO/2021/187523
Kind Code:
A1
Abstract:
The present disclosure provides a cover tape for packaging an electronic component, comprising: a base material layer; a heat-seal layer disposed on one face side of the base material layer; and an antistatic layer disposed on a face side of the base material layer opposite to the face on the heat-seal layer side. The cover tape for packaging an electronic component is characterized in that the face on the side on which the antistatic layer is disposed has a surface resistivity of 1 × 1010Ω/□ or less, the heat-seal layer comprises an antistatic agent, and the cover tape for packaging an electronic component has a light transmission rate of not less than 80% at an incident angle of 40°.
Inventors:
YANAGISAWA SHUNPEI (JP)
NAGATSUKA YASUNORI (JP)
INOUE MASAKUNI (JP)
NAGATSUKA YASUNORI (JP)
INOUE MASAKUNI (JP)
Application Number:
PCT/JP2021/010797
Publication Date:
September 23, 2021
Filing Date:
March 17, 2021
Export Citation:
Assignee:
DAINIPPON PRINTING CO LTD (JP)
International Classes:
B32B27/18; B32B7/025; B65D75/34; B65D85/86
Domestic Patent References:
| WO2004094258A1 | 2004-11-04 |
Foreign References:
| JP2003246358A | 2003-09-02 | |||
| JP2006232405A | 2006-09-07 | |||
| JP2012012032A | 2012-01-19 | |||
| JP2006021817A | 2006-01-26 | |||
| JP2001348561A | 2001-12-18 | |||
| JP2000280411A | 2000-10-10 | |||
| JP2004025570A | 2004-01-29 |
Attorney, Agent or Firm:
YAMASHITA, Akihiko et al. (JP)
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