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Title:
CURABLE ADHESIVE SHEET AND METHOD FOR PRODUCING CURABLE ADHESIVE SHEET
Document Type and Number:
WIPO Patent Application WO/2020/196119
Kind Code:
A1
Abstract:
The present invention relates to a curable adhesive sheet provided with an adhesive layer formed from an adhesive composition containing an epoxy resin, a latent curing agent, and a gelling agent. The latent curing agent has a reaction initiation temperature of 45-120°C.

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Inventors:
TANAKA AKIKO (JP)
NISHIMARU AYUMI (JP)
YASUI ATSUSHI (JP)
Application Number:
PCT/JP2020/011847
Publication Date:
October 01, 2020
Filing Date:
March 17, 2020
Export Citation:
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Assignee:
NITTO DENKO CORP (JP)
International Classes:
C09J7/38; C09J7/35; C09J11/06; C09J11/08; C09J163/00
Domestic Patent References:
WO2011062149A12011-05-26
Foreign References:
JPH10168400A1998-06-23
JP2016186843A2016-10-27
JP2012224733A2012-11-15
JPH09157620A1997-06-17
JP2019065068A2019-04-25
Other References:
See also references of EP 3950869A4
Attorney, Agent or Firm:
EIKOH PATENT FIRM, P.C. (JP)
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