Title:
CURABLE COMPOSITION AND ADHESIVE
Document Type and Number:
WIPO Patent Application WO/2023/032700
Kind Code:
A1
Abstract:
The present disclosure provides a curable composition that contains an -ene compound and a thiol compound, a resulting cured product of which can be highly flexible, and is less likely to lose preservation stability. A curable composition according to the present disclosure contains a cure component (A) comprising an -ene compound (A1) and a thiol compound (A2), a filler (C), and an anionic polymerization initiator (D). The filler (C) contains a silicone powder (C1), and the anionic polymerization initiator (D) contains a microcapsule-based curing catalyst (D1).
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Inventors:
SHINOZAKI HIROKI
WAKAIKI TAKAHIRO
WAKAIKI TAKAHIRO
Application Number:
PCT/JP2022/031277
Publication Date:
March 09, 2023
Filing Date:
August 18, 2022
Export Citation:
Assignee:
PANASONIC IP MAN CO LTD (JP)
International Classes:
C08G75/045; C08L83/04; C09J4/02; C09J11/08
Domestic Patent References:
| WO2018047849A1 | 2018-03-15 | |||
| WO2016021531A1 | 2016-02-11 |
Foreign References:
| JP2015172176A | 2015-10-01 | |||
| JP2015012069A | 2015-01-19 | |||
| JP2017101112A | 2017-06-08 |
Attorney, Agent or Firm:
HOKUTO PATENT ATTORNEYS OFFICE (JP)
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