Title:
CURABLE COMPOSITION, CURED FILM USING SAID COMPOSITION AND OVERCOAT FILM
Document Type and Number:
WIPO Patent Application WO/2017/183496
Kind Code:
A1
Abstract:
[Problem] To provide a thermosetting resin composition which forms a protection film for flexible wiring boards, said protection film having excellent bending resistance and being sufficiently suppressed in warping, while maintaining high electrical insulation reliability under high temperature and high humidity conditions.
[Solution] A curable composition according to the present invention contains: (component A) a compound which has a specific structural unit, at least one of an imide bond and an amide bond, and a functional group that is reactive with a curing agent; (component B) a curing agent; and (component C) an organic solvent. It is preferable that (component A) contains a compound which is obtained by a reaction that uses, as essential components, (starting material a) a trivalent and/or tetravalent polycarboxylic acid derivative having an acid anhydride group, (starting material b) a polyol represented by formula (2), and (starting material c) a polyisocyanate.
Inventors:
OOGA KAZUHIKO (JP)
SUZUKI KAI (JP)
SUZUKI KAI (JP)
Application Number:
PCT/JP2017/014629
Publication Date:
October 26, 2017
Filing Date:
April 10, 2017
Export Citation:
Assignee:
SHOWA DENKO KK (JP)
International Classes:
C08L101/02; C08K5/00; C08L63/00; C08L75/04; C09D7/12; C09D167/03; C09D175/06; H05K3/28
Domestic Patent References:
| WO2016002874A1 | 2016-01-07 |
Foreign References:
| JP2010132735A | 2010-06-17 | |||
| JP2015147940A | 2015-08-20 | |||
| JP2015054923A | 2015-03-23 |
Attorney, Agent or Firm:
SSINPAT PATENT FIRM (JP)
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