Title:
CURABLE COMPOSITION AND CURED PRODUCT OF SAME
Document Type and Number:
WIPO Patent Application WO/2021/200267
Kind Code:
A1
Abstract:
[Problem] To provide: a curable composition that has application properties suitable for inkjet printing methods; and a cured product thereof that has low warpage, solder heat resistance, resolution, and fire resistance suitable as a solder resist of a flexible printed wiring board. [Solution] A curable composition at least comprising components (A)-(D): (A) three types of compounds having one, two, or three (meth)acryloyl groups in a single molecule; (B) a flame retardant having a phosphazene structure and a phenoxy group substituted by a cyano group (-CN), a hydroxyl group (-OH), or a methyl group; (C) a photoinitiator; and (D) a thermosetting component, wherein the viscosity of the composition is 50 mPa·s or less at 50℃. A cured product obtained from said curable composition. An electronic component having said cured product.
Inventors:
YOKOYAMA YUTAKA (JP)
TAKASHIMA SHUHEI (JP)
ITO HIDEYUKI (JP)
ODAGIRI YUTO (JP)
YONEDA KAZUYOSHI (JP)
TAKASHIMA SHUHEI (JP)
ITO HIDEYUKI (JP)
ODAGIRI YUTO (JP)
YONEDA KAZUYOSHI (JP)
Application Number:
PCT/JP2021/011345
Publication Date:
October 07, 2021
Filing Date:
March 19, 2021
Export Citation:
Assignee:
TAIYO INK MFG CO LTD (JP)
International Classes:
C08F220/20; C08F2/44; C08G18/62; H05K3/28
Domestic Patent References:
| WO2014024951A1 | 2014-02-13 |
Foreign References:
| JP2015173269A | 2015-10-01 | |||
| JP2019061224A | 2019-04-18 | |||
| JP2008304569A | 2008-12-18 | |||
| JP2015092228A | 2015-05-14 |
Attorney, Agent or Firm:
ETOH Toshiaki (JP)
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