Title:
CURABLE COMPOSITION, AND DRY FILM AND CURED OBJECT OBTAINED THEREFROM
Document Type and Number:
WIPO Patent Application WO/2021/157282
Kind Code:
A1
Abstract:
[Problem] To provide a curable composition capable of forming solder resists which combine flux resistance and folding endurance. [Solution] The curable composition comprises (A) an alkali-soluble resin having at least any one structure selected from among a bisphenol A structure, a bisphenol F structure, and a urethane structure, (B) a photopolymerization initiator, and (C) an epoxy resin having an isocyanurate structure, wherein the epoxy resin (C) having an isocyanurate structure has a structure in which a nitrogen atom contained in the isocyanurate structure has been bonded to an epoxy group by an alkylene chain having two or more carbon atoms. [Selected drawing] None
Inventors:
CHA HANEUL (JP)
FUKUDA SHINICHIRO (JP)
FUKUDA SHINICHIRO (JP)
Application Number:
PCT/JP2021/000504
Publication Date:
August 12, 2021
Filing Date:
January 08, 2021
Export Citation:
Assignee:
TAIYO INK MFG CO LTD (JP)
International Classes:
C08F299/00; C08G59/02; G03F7/004; G03F7/027; G03F7/032; H05K3/28
Domestic Patent References:
| WO2011093188A1 | 2011-08-04 | |||
| WO2019065902A1 | 2019-04-04 | |||
| WO2011093236A1 | 2011-08-04 | |||
| WO2020066049A1 | 2020-04-02 |
Foreign References:
| JP2016079384A | 2016-05-16 |
Attorney, Agent or Firm:
ETOH Toshiaki (JP)
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