Title:
CURABLE COMPOSITION FOR FORMING ELASTIC RESIN LAYER
Document Type and Number:
WIPO Patent Application WO/2018/079608
Kind Code:
A1
Abstract:
Disclosed is a curable composition for forming an elastic resin layer, the curable composition containing (A) an elastomer having a polystyrene chain, (B) a monofunctional linear alkyl(meth)acrylate, (C) a monofunctional (meth)acrylate having an alicyclic group, (D) a bi- or higher functional compound having two or more ethylenically unsaturated groups, and (E) a polymerization initiator.
Inventors:
SHIBATA TOMOAKI (JP)
UEHARA SATOSHI (JP)
IKEDA AYA (JP)
OTAKE SHUNSUKE (JP)
MINEGISHI TOMONORI (JP)
TENDOU KAZUYOSHI (JP)
UEHARA SATOSHI (JP)
IKEDA AYA (JP)
OTAKE SHUNSUKE (JP)
MINEGISHI TOMONORI (JP)
TENDOU KAZUYOSHI (JP)
Application Number:
PCT/JP2017/038518
Publication Date:
May 03, 2018
Filing Date:
October 25, 2017
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
C08F2/44; C08F287/00; C09D153/02; H01L21/56; H05K1/03
Domestic Patent References:
WO2016080346A1 | 2016-05-26 |
Foreign References:
JPS5747308A | 1982-03-18 | |||
JPH06192350A | 1994-07-12 | |||
JPS60118653A | 1985-06-26 | |||
JPS6013861A | 1985-01-24 | |||
JPH0790228A | 1995-04-04 | |||
JP2013168575A | 2013-08-29 | |||
JPH07300540A | 1995-11-14 | |||
JP2017188546A | 2017-10-12 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Download PDF: