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Patent Searching and Data


Title:
CURABLE COMPOSITION AND METHOD FOR PRODUCING CURABLE FILM
Document Type and Number:
WIPO Patent Application WO/2014/034671
Kind Code:
A1
Abstract:
 Provided is a curable composition with which it is possible to obtain a low dielectric constant curable film which, while maintaining water repellency, exhibits lipophilic properties which enable the application of an organic solvent-based coating solution, and which has adequate insulating properties. Also provided is a method for producing a curable film using said curable composition, and a semiconductor element using a cured film obtained by curing said curable composition. This curable composition contains: (A) a fluorine-containing polyarylene prepolymer having a crosslinkable functional group; (B) a compound having a number average molecular weight of 140 to 3,000 and which does not contain fluorine atoms, but has two or more crosslinkable functional groups; (C) a compound having a number average molecular weight exceeding 3,000 but not exceeding 50,000, not containing fluorine atoms, having a C6-24 alkyl group and a crosslinkable functional group, and in which ether-type oxygen atoms may be present between carbon atoms; and (D) a radical polymerization initiator.

Inventors:
ITO MASAHIRO (JP)
TSURUOKA KAORI (JP)
Application Number:
PCT/JP2013/072887
Publication Date:
March 06, 2014
Filing Date:
August 27, 2013
Export Citation:
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Assignee:
ASAHI GLASS CO LTD (JP)
International Classes:
C08F299/00; H01L29/786; H01L51/05; H01L51/30
Domestic Patent References:
WO2009154254A12009-12-23
WO2013089204A12013-06-20
WO2011162001A12011-12-29
Foreign References:
JP2010163521A2010-07-29
JP2005513788A2005-05-12
JP2007005698A2007-01-11
Other References:
See also references of EP 2891670A4
Attorney, Agent or Firm:
SENMYO, Kenji et al. (JP)
Spring name Kenji (JP)
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